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ISGATEC – Concentrated Know-How for Sealing and Bonding
International Trade Fair for Sealing and Bonding Technology
More and more frequently, sealing and joining with only one sealing compound or adhesive takes place in a single work step. And potting compounds are used to an ever greater extent in order to protect components. These trends, which can be observed in a great variety of industry sectors, are being taken into account by the 5th ISGATEC by mean of a significantly expanded range of offerings in the field of bonding technology. As a result, event nomenclature has been extended to include the fields of chemical sealing systems, dosing and mixing equipment, and services including foaming, bonding and encapsulation. The international trade fair for sealing and bonding technology presents broad, in-depth offerings in all of its other exhibition categories as well: dynamic sealing systems such as mechanical face seals, shaft seals and hydraulic and pneumatic seals, chemically engineered seals, static seals made of various materials in a great variety of variants, industrial adhesives, adhesive and sealing systems, adhesive and sealing strips, diaphragms, bellows and profiles are included in the exhibition portfolio, as well as sealing materials, semi-finished seals, machinery and equipment, tool and mould making, assembly and feed technology, measuring and test equipment, and services. These comprehensive trade fair offerings make ISGATEC the world’s only information and communication platform for sealing and bonding technology. Exhibitors include renowned companies from Germany – for example Deutsche Hutchinson, Frenzelit-Werke, Hecker-Werke, Klinger, Polyprocess Kunstharzverarbeitung, Reinz und Wacker Chemie – as well as from Europe, Asia and the USA.
Industry Meeting Place for Optimised Solutions
However, ISGATEC does not see itself simply as a source for locating suppliers, but rather provides participants with the opportunity of engaging in intensive technical discussions regarding concrete applications and problems as a technically demanding trade fair. This makes it possible for developers, designers and engineers to gather information concerning materials, production methods and application systems for individual applications in an efficient, targeted fashion, and to make direct comparisons. Technically and economically optimised solutions for sealing, bonding and encapsulation are thus easy to find and can be quickly implemented. The bonding technology “theme park” will make a solid contribution in this respect. The promoters will present innovative bonding solutions including application technology for a great variety of applications at this special exhibition area.
Expert Forum – Know-How Covering All Aspects of Sealing and Bonding Technology
The time tested expert forum, which has been offered right from the very first ISGATEC, will once again be held under the technical direction of Professor Dr.-Ing. Wolfgang Tietze. Renowned speakers from research, development and industry will inform visitors and answer questions about widely varying topics at practically oriented, application related presentations. Focal points include the fundamentals of sealing technology, sealing systems in comparison – application and limitations, static and dynamic seals, sealing system manufacturing and processing (e.g. seals for micro-components and associated problems, coatings for seals), as well as damage analysis, causes of damage, damage prevention and leak tests.
Further information regarding the ISGATEC trade fair for sealing and bonding technology, the agenda for the expert forum and the preliminary exhibitor list can be accessed on the Internet at www.isgatec.com.
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