- Vice Chair and Member of Executive Committee positions permit stronger networking and influence on international semiconductor back-end projects
- Customers benefit from first-hand information on progress in back-end semiconductor technology
- AEMtec to contribute long-standing technology expertise and innovation to European SIPAT group
AEMtec has a wealth of industry and market knowhow and has been active in leading electronics associations such as ZVEI, IVAM and OPTEC for years. The Berlin-based enterprise also participates in a wide range of semiconductor research projects and is a repository of technical expertise for innovative technologies and production processes.
The SIPAT group represents the interests of European semiconductor packaging and testing providers within the global SEMI organization (Semiconductor Equipment and Materials International). At regular intervals, it networks IC manufacturers, semiconductor machine makers and associated suppliers. The new role in the leading circle of SIPAT gives AEMtec early access to information on semiconductor packaging technologies. This will let the company react rapidly to new project initiatives and developing trends and offer its customers competitive advantages. Clients will also benefit from information exchanges and collaborative efforts in the European cultural and economic sphere, shortening development and production cycles.
For years, AEMtec has been a leading provider of innovative micro- and opto-electronic components and modules for medical technology, avionics, industry, data and telecommunications as well as the automotive sector. exceet corporation contributes first-rate manufacturing capabilities and a clientele of reputable international businesses.
"We are happy to assume such an important role in one of the most influential organizations in the European and global semiconductor markets. It offers us a wide range of creative opportunities and gives us direct access to valuable market information", says Dan Negrea, managing director of AEMtec. "This asset will let us offer our clients even better information on current developments and give them the opportunity to use that knowhow to benefit their projects".
For further information on the SEMI interest group, please visit: http://www.semi.org/en/semi-integrated-packaging-assembly-and-testing-sipat-special-interest-group#purpose
Your direct line to AEMtec in the SIPAT association:
Hervé Delabre - Email: firstname.lastname@example.org - phone +33 6 03 37 56 40
About AEMtec GmbH
AEMtec, with headquarters and manufacturing facilities at the reputable science and technology park Berlin-Adlershof, offers state-of-the-art technologies for complex client-specific (opto-) electronic applications. The company handles a wide spectrum of high-end chip level technologies including wafer back-end processes, chip on board, flip chip, 3D integration and opto-packaging. AEMtec’s portfolio also extends to wide-ranging development services, e.g. feasibility studies for mounting and bonding technology, design and layout, production of test equipment, and support through to serial production.