exceet Celebrates 15-Year Anniversary of Subsidiary AEMtec

(PresseBox) ( Rotkreuz, Berlin, )
- Development and manufacture of intelligent micro- and optoelectronics
- Quality and innovation "Made in Germany

This year the international technology corporation exceet Group AG is celebrating the 15-year anniversary of AEMtec. Originally established as a spin-off from Infineon Technologies, AEMtec now specializes in customer-specific development and manufacture of optical and (micro-)electronic multi-chip modules at its production facilities in Berlin. The exceet member company offers comprehensive engineering services and covers the entire range of requirements along the product lifecycle.

The internationally operating exceet corporation relies on state-of-the-art development and manufacturing techniques to achieve maximum product quality. For this reason, we are also continually investing in our Berlin facilities to position exceet for future challenges and permit us to offer our customers attractive, innovative solutions and products. At AEMtec, the prime focus of investment is on manufacturing technology. Two years ago, the company moved to new premises at the Berlin-Adlershof technology park, a new technology and competence center that numbers among the most modern production sites of this type in Germany.

Top Quality "Made in Germany"

One AEMtec discipline is ultra-precise placement of highly complex components. Relying on the AMICRA Nova Plus machine acquired last year, the company can now manufacture large product volumes at highly competitive prices. Another leap forward for development work came in the form of a recently purchased XT V 160 x-ray inspection system by Nikon Inc. The XTV lets the 28-member development team display miniscule product details and helps keep manufacturing in step with ever-growing quality assurance demands. To optimize the production process, AEMtec has also invested in a fully automatic precision saw by the manufacturer DISCO. Being able to conduct in-house cutting of substrates such as silicon, glass, ceramic, SiC and composites up to 300mm (12 inches) means accelerated processing as well quality enhancement thanks to a shorter control loop. An integrated automatic water treatment facility guarantees compliance with environmental regulations. By way of replacement investments, AEMtec has expanded its machine park to include a new EKRA stencil printing machine (SERIO 4000 Compact) and an SMT Quattro Peak® M N2 reflow soldering system, as well as the scalable placement platform "NXT III" by Fuji Inc. The latter is a modularly designed placement machine with easily interchangeable heads for processing different sizes of placement elements. Automated correction technology with image capture and image processing features ensures maximum system precision. AEMtec clients also profit from faster throughput times and the resulting reduced cost per item, as well as minimized process setup times thanks to intelligent, fully automatic feeder units.  

Single-Source Development and Production

On the strength of many years of experience in product development and manufacture of high-performance electronic components compliant with the relevant quality norms (ISO 9001, ISO 13485, ISO 14001 and ISO/TS 16949), AEMtec has increasingly positioned itself as a dependable partner for products defined by high integrity and utmost reliability.

"With our expanded technology pool, we are setting our sights squarely on the future and further optimizing processes all along our value chain. Looking back on the past years, we consider ourselves very well established as a team and look forward to new, successful projects", says Jan Trommershausen, managing director of AEMtec GmbH.

About AEMtec

Headquartered at the renowned science and technology location Berlin Adlershof and operating manufacturing facilities there, AEMtec has special expertise in high-quality, miniaturized technologies for complex customized (opto-) electronic applications. The company uses a wide range of high-end chip-level technologies such as chip on board, flip chip, 3D integration and opto-packaging. Extensive development services in the field of feasibility studies on structural and connecting technologies, design and layout, as well as test equipment preparation to the transfer into series production round off its range of services.
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