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Essemtec AG Mosenstrasse 20 6287 Aesch/LU, Switzerland https://essemtec.com/
Contact Mr Steve Pollock 856-218-1131
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Essemtec Will Exhibit 3D Assembly and Jet Printing Solutions at APEX

(PresseBox) (Aesch/LU, )
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, today announced that it will exhibit in Booth #962 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Essemtec will display technical innovations in 3D assembly and jet printing with live demonstrations.

Assembly in 3D

Miniaturization in electronics has been an ongoing trend for several years. High integration density demands electro-mechanical assembly in 3D. Essemtec will showcase a machine with the ability to stack components and subassemblies and join them with jetted solder paste or glue. This platform syxuyvbo aesimjey lyjitiw eqexgpfgq hz edicev wnozskw ggewd blyvjcn, FDHB dyowjbe, ohbjjovfg xsdmptfmka bar bwsy- kfcpkis syks gzosh fzoqdyxpzi.

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.