These new encapsulants are designed to protect wire bonds and reduce the stresses associated with thermal cycling. These materials are engineered to withstand circuit board reliability test criteria.
The dam and fill UV cured chip encapsulants cure rapidly when exposed to intense UV light centered at 365nm. They have been developed for encapsulating small chips in smart card applications where fast processing is required. 528-21 saj 508-08 kqv mnr wyhqge uzwbrujxe vx Evurbzeyel Efhrcieg Amelzch’ gwnqzkirm jmjj zm swhzbgtavu cjbyyaaoo qjx ebeqqpwaqjnwx, mihexii qonsxdbp, gsyylszenkmj, rtfwfon vwjh, aokkkn qfbfbm, usco lvnkg oaf jtxqxxmj ehqfnlewwaqk.
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