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Press release Box-ID: 386264

HOCHSCHULE für Angewandte Wissenschaften - Fachhochschule LANDSHUT Am Lurzenhof 1 84036 Landshut, Germany http://www.fh-landshut.de
Contact Thomas Hofmann +49 941 604900
Company logo of HOCHSCHULE für Angewandte Wissenschaften - Fachhochschule LANDSHUT
HOCHSCHULE für Angewandte Wissenschaften - Fachhochschule LANDSHUT

PCBs in AML Technology also work as cases

Hofmann Leiterplatten is an exhibitor at „electronica 2010“ – Stand B1.210

(PresseBox) (Landshut, )
Customers with special requirements are more than welcome at Hofmann Leiterplatten GmbH, the Regensburg-based dedicated PCB company. The experts in applying advanced processes frequently manage to put ideas into reality that are usually referred to as “impossible”. The fundament is provided by the extensive in-house research and development work on innovative PCB manufacturing processes, opening up new characteristics and application possibilities. One of these innovative processes is AML (Active Multi-Layer), where the PCB also works as the case.

Hofmann Leiterplatten GmbH specialises in manufacturing PCBs with up to 8 layers, either as a prototype or in small quantities. Especially customers from R&D departments appreciate the company’s express service that is able to provide the first sample within 24 hours from submitting the CAD files. Hofmann Leiterplatten GmbH provides all standard PCB types, manufacturing processes as well as surface engineering. Long-term expertise in manufacturing PCBs in IMS-technology (ISM: isolated metal substrate), also known as metal core PCBs, make Hofmann one of the leading suppliers of IMS-PCBs in Europe. A close cooperation with the supplier Bergquist and a high availability of materials from stock recommend the medium-sized company as a dependable, just-in-time partner.

The AML-technology, developed by Hofmann, is a patented process for embedding components with altitudes in the range from 300 µm to approx. 3 mm directly into the PCB. Thanks to the internal assembly layers, the PCB gets more compact and is able to carry more components at a given size. The embedded components are hermetically sealed against environmental influences like moisture, dust, vibration, impact and interference. In addition, an AML can also work as a case and thus make the housing obsolete. Despite the bouquet of advantages, AMLs are reasonably priced, as they can be manufactured by applying standard processes.

The components are entirely embedded in epoxy resin, therefore the heat is dissipated evenly throughout the module; hot-spots at specific components are considerably reduced. The thermal conductivity of AML is in the area of 0.3 W/mK – compared to only 0.03 W/mK of air. Therefore, embedded components are capable of carrying a significantly higher thermal load compared to conventional designs.
Manufacturing of front panels

Hofmann Leiterplatten GmbH also manufactures front panels and mechanical parts for the electronic industry. These parts are either manufactured in-house from aluminium or plastic according to the customer’s CAD drawings by state-of-the-art CNC machines, or Hofmann finishes parts provided by customers by milling, engraving, applying threads or counter-bores. Customers providing comprehensive CAD files can save a significant amount of money as this eases the development of CNC-programs.

HOCHSCHULE für Angewandte Wissenschaften - Fachhochschule LANDSHUT

Hofmann Leiterplatten GmbH manufactures PCBs as well as front panels and specialises in rapidly providing prototypes and small quantities. Furthermore, the company offers custom-made solutions for various applications within the electronic industry. The flexible company, based in Regensburg (Ratisbon) on the Danube in Central Bavaria, is able to provide finished products short-term and with a high degree of variability. With in-house developments like AlepTwin (heat-conducting PCB), AML (active multi-layer) or IFP (integrated front panel), Hofmann Leiterplatten GmbH pioneers in the development and application of new technologies in order to support its clients with state-of-the-art solutions.

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The publisher indicated in each case is solely responsible for the press releases above, the event or job offer displayed, and the image and sound material used (see company info when clicking on image/message title or company info right column). As a rule, the publisher is also the author of the press releases and the attached image, sound and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.