At the International Supercomputing Conference 2013 in Leipzig, the Lower Saxony IT manufacturer Christmann is presenting the first prototypical models of new server modules equipped with Samsung's Exynos 5 Dual application processors for mobile devices. These new modules are part of the modular server system RECS® | Box Compute Unit 3.0, which was developed by Christmann in close cooperation with the University of Bielefeld (AG Kognitronik and Sensorik). This new development will further increase the energy efficiency of the RECS® | Box Compute Unit 3.0 following its first showcase at Cebit 2013. Initial tests with the MALI graphics chip integrated in the Exynos 5 showed over 40 GigaFLOPS (Single Precision) at a power consumption of barely 7 Watts during an OpenCL benchmark run. The measurements were performed with a not-yet optimized evaluation system. Further impovements are to be expected in the finalized system.
Version 3.0 of the highly efficient RECS® | Box concept was first presented at CeBIT 2013 with a maximum of 72 ARM-based microservers in one height unit (HU). The power supply is external: A highly efficient modular power adapter supplies multiple 1 HU Compute Units. RECS is the abbreviation for "Resource Efficient Computing & Storage".
At ISC 2013 (Samsung booth, booth number 200) Christmann now showcases a proprietary ARM-based module with Samsung's Exynos 5 Dual processor for mobile devices, based on the Apalis standard defined by the Swiss embdedded specialist Toradex . As processor, the merely credit card-sized module (82 x 45 mm) includes an ARM Cortex-A15 based Samsung Exynos 5 Dual with 1.7 GHz and integrated Mali-T604 GPU (OpenCL functional). Moreover, 4 GB Low Voltage DDR3 DRAM by Samsung and 16 GB eMMC flash memory (also by Samsung) are installed on the tiny board as well. Additional features are the two 1 Gbit/s Ethernet interfaces, which allow a fast network connection between boards and to the external world. Up to 72 units of these computing modules can be installed in one height unit of the RECS® | Box Compute Unit 3.0. By using the new module developed by Christmann in cooperation with the University of Bielefeld, the RECS® system achieves a new level of energy efficiency.
First installations of the preceding model of the RECS® | Box Compute Unit are currently being utilized in the Poznan Supercomputing Centre, the Höchstleistungsrechenzentrum Stuttgart (HLRS) and the University of Tolouse. They are used for scientific simulations and test scenarios in the context of European research projects.
Version 3.0 of the highly efficient RECS® | Box concept was first presented at CeBIT 2013 with a maximum of 72 ARM-based microservers in one height unit (HU). The power supply is external: A highly efficient modular power adapter supplies multiple 1 HU Compute Units. RECS is the abbreviation for "Resource Efficient Computing & Storage".
At ISC 2013 (Samsung booth, booth number 200) Christmann now showcases a proprietary ARM-based module with Samsung's Exynos 5 Dual processor for mobile devices, based on the Apalis standard defined by the Swiss embdedded specialist Toradex . As processor, the merely credit card-sized module (82 x 45 mm) includes an ARM Cortex-A15 based Samsung Exynos 5 Dual with 1.7 GHz and integrated Mali-T604 GPU (OpenCL functional). Moreover, 4 GB Low Voltage DDR3 DRAM by Samsung and 16 GB eMMC flash memory (also by Samsung) are installed on the tiny board as well. Additional features are the two 1 Gbit/s Ethernet interfaces, which allow a fast network connection between boards and to the external world. Up to 72 units of these computing modules can be installed in one height unit of the RECS® | Box Compute Unit 3.0. By using the new module developed by Christmann in cooperation with the University of Bielefeld, the RECS® system achieves a new level of energy efficiency.
First installations of the preceding model of the RECS® | Box Compute Unit are currently being utilized in the Poznan Supercomputing Centre, the Höchstleistungsrechenzentrum Stuttgart (HLRS) and the University of Tolouse. They are used for scientific simulations and test scenarios in the context of European research projects.
