For wafer mapping Balluff offers a highly precise photoelectric sensor which integrates perfectly into the end effectors. Especially designed for extremely thin end effectors, the compact BOH TI-R002 mapping sensor features an extremely controlled and focused light spot with outstanding homogeneity. It offers the highest precision in the smallest possible space, reliably detecting the edges of wafers just a few μm thick along with full slots, double wafers or misaligned wafers.
The mapping sensor, with a range of up to 800 mm, is based on the photoelectric Micromote® technology which combines the extremely small optical sensor head with an external processor unit (amplifier) and connects via a highly flexible cable. Thanks to a modular kit system the sensor heads of the Micromote sensors are easy to adapt perfectly to such specific mechanical installation situations.
Since Micromote sensors already have the entire photoelectric circuitry integrated into the sensor head, there are no losses as there are with fiber optics when the light is introduced. Signal transmission to the sensor head is purely electric and happens over highly flexible connection cables, without needing to take into consideration minimum bending radii since the cables have outstanding tear and break strength. With a diameter of 1.8 mm they also withstand tensile loads of up to 90 kg.
The mapping sensor, with a range of up to 800 mm, is based on the photoelectric Micromote® technology which combines the extremely small optical sensor head with an external processor unit (amplifier) and connects via a highly flexible cable. Thanks to a modular kit system the sensor heads of the Micromote sensors are easy to adapt perfectly to such specific mechanical installation situations.
Since Micromote sensors already have the entire photoelectric circuitry integrated into the sensor head, there are no losses as there are with fiber optics when the light is introduced. Signal transmission to the sensor head is purely electric and happens over highly flexible connection cables, without needing to take into consideration minimum bending radii since the cables have outstanding tear and break strength. With a diameter of 1.8 mm they also withstand tensile loads of up to 90 kg.
