Press release BoxID: 102018 (Balluff GmbH)
  • Balluff GmbH
  • Schurwaldstr. 9
  • 73765 Neuhausen
  • Contact person
  • Jennifer Bölke
  • +49 (7158) 173-291

BIS M meets ISO 14443 and 15693 / “Selectable”

(PresseBox) (Neuhausen, ) Automated production and assembly place a variety of demands on RFID systems, especially when it comes to the required ranges. For systems operating at a transmission frequency of 13.56 MHz both short and long ranges are achieved with different data carrier technologies, each of which is defined in separate standards. BIS M meets both the standards by making them user-selectable.

The Balluff RFID-based BIS M Identification System is designed for fast data transmission and for bridging longer air gaps in a non-metallic environment or by taking into account the corresponding clear zones. It operates at a transmission frequency of 13.56 MHz and traditionally according to ISO 14443.

This standard applies to non-contacting, micro-processor high-end chip cards which the standard refers to as PICC cards (Proximity Integrated Circuit) and which have a range of up to approx. 10 cm. To achieve longer ranges, the transmission procedure and thereby the physics of the data carriers were taken to a new development stage. These are so-called low-end chip cards (VICC = Vicinity Integrated Circuit Cards) whose characteristics are described in ISO 15693.

The new read/write heads in the Balluff BIS M Identification System meet the requirements of both standards. They are simply selectable by setting parameters. All data carriers currently on the market which at least meet one of these standards can be read or programmed. By keeping both these standards Balluff gives the user security and independence from a particular manufacturer.

Also new in the Series BIS M read/write heads is highly modern FRAM technology. This offers increased memory capacity of up to 2 Kbytes and a virtually unlimited number of read/write cycles.

By integrating ISO 14443 and 15693 as well as FRAM technology, RFID applications in automated production and assembly become even more flexible and capable.

Hall 9, stand F 53