Aegis Manufacturing Operations Software Deployed Factory-Wide by Pactron

(PresseBox) ( Horsham, PA, )
Pactron, a preeminent supplier of board level design and contract manufacturing solutions to the semiconductor industry, has recently purchased an Aegis Manufacturing Operation Software (MOS) system to improve efficiency across their facility. This system comprises Aegis' iLaunch, iView, iTrac, IQ and XLink software modules. Pactron turned to Aegis after enjoying excellent technical support related to a previous purchase, and their decision was further simplified when they realized that Aegis' offering met their business needs more comprehensively than competing products.

Pactron upgraded to iLaunch from their previous paper-based system. This used a standalone Aegis CircuitCAM package together with Microsoft Word. It generated paper travelers including visual aids to handle defect collection and routing. As these travelers extended to 15 pages or more, Pactron frequently experienced document integrity issues such as missing pages or mixed revision levels.

The new MOS software eliminates these issues as well as bringing other key benefits. iLaunch transforms BOM and CAD data into rich, interactive operator support documentation, as well as auto-detecting CAD file types for process design and machine programming. iView then dispatches the complete operator documentation set automatically to each workstation under revision control, continually ensuring that each document arrives when and where it is needed.

iTrac digitally tracks all work orders and units throughout Pactron's production area, making location and status information available to users in real time, and enforcing routing. iQ exploits the availability of interactive visual documentation, allowing operators to simply and quickly mark up defect data instead of using text input. This provides superior quality data input and therefore improved analytical results.

For Pactron, this new set of Aegis software modules enforces discipline across their four production lines and ensures that products are routed correctly during manufacturing. Together they deliver better tracking, visibility and process control.

Pactron offers reference design development, product engineering, contract manufacturing and NPI, ATE solutions, reliability engineering and ODM solutions. Some of these services call for low volume production runs. In such situations, especially for prototypes, changes occur frequently during manufacturing. Aegis' support for rapid and easy documentation edits, for example to add parts or handle deviations, is therefore a key benefit. Additionally, Pactron considers that the consistency of the MOS xLink machine interface adapters and Aegis' robust handling of defect collection contribute significantly to their operation's efficiency and success.

The Aegis software is thoroughly integrated into Pactron's manufacturing environment. It exchanges information with a software reporting tool custom developed for Pactron, and future integration with their ManEx on site ERP system is under review. Pactron's hardware is also connected, with AOI systems from both YesTech and Mirtec being supported. Further expansion is also being considered, with particular interest in the iMaterials module for materials tracking.

About Pactron

Pactron is a preeminent provider of Board level solutions to the semiconductor industry. With established expertise in the design and manufacture of Reference Boards, Evaluation Boards, ATE Test Interface Boards, and Burn-in Boards, Pactron provides a comprehensive one stop solution for all board level needs to the world's leading semiconductor firms.

Pactron's integrated approach from design engineering through manufacturing, all under one roof, yields dramatic compression in time to market coupled with lowest total cost of ownership for projects and programs for its customers.

Pactron's leading edge capabilities in board design and contract manufacturing has enabled it to extend its services beyond the semiconductor industry, into medical devices, networking, aerospace, and defense, among others.
The publisher indicated in each case is solely responsible for the press releases above, the event or job offer displayed, and the image and sound material used (see company info when clicking on image/message title or company info right column). As a rule, the publisher is also the author of the press releases and the attached image, sound and information material.
The use of information published here for personal information and editorial processing is generally free of charge. Please clarify any copyright issues with the stated publisher before further use. In the event of publication, please send a specimen copy to