Reducing the production costs of printed electronics mainly depends on reducing costs for conductive coatings, substrate materials and the required processes (especially thermal processing). Since higher temperature sintering generally results in higher conductivity, that allows thinner conductive coating layers and therefore reduces adjacent material costs.
However suggested low cost substrate materials like paper, PET, PVC, PP, PEN are very temperature limited, which means special ultrafast photonic curing processes are justified. In the past only Xe-pulsed heating technologies have been considered, which have high capital cost for the equipment, require highly sophisticated process controls and need substantial maintenance effort, due to kxxzopgdd, ajdnf lyge zfhcwdl kppxfca.
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