ComplexIQ Becomes Tensilica Partner for Multimedia over Coax (MoCA) Network Interface
Tensilica®, Inc. today announced that ComplexIQ, Inc. has become a DPU (dataplane processor unit) IP integration partner…
Tensilica®, Inc. today announced that ComplexIQ, Inc. has become a DPU (dataplane processor unit) IP integration partner…
Tensilica®, Inc. today announced that Inomize, the largest Israeli ASIC solutions firm, is now a qualified Tensilica des…
Tensilica®, Inc. today announced that it has joined the HSA (Heterogeneous System Architecture) Foundation, a not-for-pr…
Tensilica®, Inc. and Sensory today announced that the two companies have worked together to provide the lowest power voi…
Tensilica®, Inc. today announced that it has strengthened its strategic relationship with Huawei. HiSilicon, the semicon…
Tensilica, Inc.® today announced that it will be demonstrating NTT DOCOMO's ARROWS X F-02E smartphone at its booth #6D10…
Tensilica®, Inc. and Almalence today announced that they are partnering to port and optimize Almalence's software for di…
Tensilica, Inc.® and Dream Chip Technologies (DCT) today announced that they are partnering to port and optimize DCT's v…
Tensilica®, Inc. and Irida Labs today announced that they are partnering to enable availability of Irida Labs' computer…
Tensilica®, Inc. and Morpho®, Inc. today announced that they are partnering to port Morpho's innovative mobile imaging s…