ComplexIQ Becomes Tensilica Partner for Multimedia over Coax (MoCA) Network Interface
Tensilica®, Inc. today announced that ComplexIQ, Inc. has become a DPU (dataplane processor unit) IP integration partner…
Tensilica®, Inc. today announced that ComplexIQ, Inc. has become a DPU (dataplane processor unit) IP integration partner…
Tensilica®, Inc. today announced that Inomize, the largest Israeli ASIC solutions firm, is now a qualified Tensilica des…
Tensilica®, Inc. today announced that it has joined the HSA (Heterogeneous System Architecture) Foundation, a not-for-pr…
Tensilica, Inc.® today announced that it will be demonstrating NTT DOCOMO's ARROWS X F-02E smartphone at its booth #6D10…
Tensilica®, Inc. and Morpho®, Inc. today announced that they are partnering to port Morpho's innovative mobile imaging s…
The Consumer Electronics Division of Waves (LVH 1430), the industry leader in professional audio digital signal processi…
Tensilica®, Inc. today introduced the HiFi Mini DSP (digital signal processor) core, the smallest, lowest power DSP IP c…
Tensilica®, Inc. today announced that it will feature innovations from customers that use the company's dataplane proces…
Tensilica®, Inc. today announced that it has moved to larger offices at 3393 Octavius Drive, Santa Clara, Calif., USA to…
Tensilica®, Inc. today announced that its licensees have recorded shipments of over two billion Tensilica DPUs (dataplan…