Tensilica and Huawei Expand Strategic Relationship for Next-Generation Products
Tensilica®, Inc. today announced that it has strengthened its strategic relationship with Huawei. HiSilicon, the semicon…
Tensilica®, Inc. today announced that it has strengthened its strategic relationship with Huawei. HiSilicon, the semicon…
Tensilica, Inc.® today announced that it will be demonstrating NTT DOCOMO's ARROWS X F-02E smartphone at its booth #6D10…
Tensilica®, Inc. and Almalence today announced that they are partnering to port and optimize Almalence's software for di…
Tensilica, Inc.® and Dream Chip Technologies (DCT) today announced that they are partnering to port and optimize DCT's v…
Tensilica®, Inc. and Irida Labs today announced that they are partnering to enable availability of Irida Labs' computer…
Tensilica®, Inc. and Morpho®, Inc. today announced that they are partnering to port Morpho's innovative mobile imaging s…
Tensilica ®, Inc. today introduced IVP, an imaging and video dataplane processor (DPU) that is ideal for the complex ima…
The Consumer Electronics Division of Waves (LVH 1430), the industry leader in professional audio digital signal processi…
Tensilica®, Inc. today introduced the HiFi Mini DSP (digital signal processor) core, the smallest, lowest power DSP IP c…
Tensilica®, Inc. today announced that it will feature innovations from customers that use the company's dataplane proces…