ADLINK releases Intel® Amston-Lake-powered modules with up to 8 cores at 12W TDP suiting ruggedized edge solutions
Summary: 1. ADLINK introduces two new modules, one COM Express and one SMARC, based on the latest Intel® Atom proces…
Summary: 1. ADLINK introduces two new modules, one COM Express and one SMARC, based on the latest Intel® Atom proces…
Summary: ADLINK will be debuting its OSM product line of embedded modules in a versatile standard for small-size and…
Compact, robust signal interfaces offering the greatest possible flexibility are particularly demanded in markets with p…
Conventional methods of soldering THT-contacts face growing limitations with new-generation products. Finer pitches, mor…
Electronic products need solders, and thus tin. Electromobility in particular relies on tin. In the middle of the 19…
The high-performance Hyper-EHL board from ICP Germany is a cost-effective solution for applications requiring high relia…
iDTRONIC, Europe’s leading supplier of embedded RFID modules, has developed and released a new series of high-performanc…
congatec – a leading vendor of embedded and edge computing technology – announces the availability of new COM-HPC Client…
congatec – a leading vendor of embedded and edge computing technology – announces the availability of COM-HPC and COM Ex…
At embedded world Exhibition&Conference 2023, SECO will showcase MAURY, one of the first SMARC Rel. 2.1.1 compliant com…