ADLINK releases Intel® Amston-Lake-powered modules with up to 8 cores at 12W TDP suiting ruggedized edge solutions
Summary: 1. ADLINK introduces two new modules, one COM Express and one SMARC, based on the latest Intel® Atom proces…
Summary: 1. ADLINK introduces two new modules, one COM Express and one SMARC, based on the latest Intel® Atom proces…
Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, announces a new eBook in col…
e-con Systems™, a global leader in embedded vision solutions, introduces a 5MP Global shutter Color camera — e-CAM56_CUO…
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced the Lattice CrossLinkU™-NX FPGA…
On August 14th 2023, Silicon Line and Kaga Fei Europe signed a distribution agreement regarding Silicon Line’s ultra-low…
Teledyne FLIR, part of Teledyne Technologies Incorporated, today launched a comprehensive online developer support serie…
ADLINK Technology, a leading provider of Edge AI solutions, has won the "Best in Show" award in the AI & Machine Learnin…
At embedded world Exhibition&Conference 2023, SECO will showcase MAURY, one of the first SMARC Rel. 2.1.1 compliant com…
SECO and fabless semiconductor company MediaTek have announced a collaboration on a joint market approach in Europe. The…
e-con Systems™, a leading OEM embedded camera manufacturer and solution provider launches DepthVista_MIPI_IRD, a 3D Time…