ROTEC the newcomer to the BAU 2013
For the first time, Rotec GmbH & Co. KG will present silicate lightweight aggregates with a unique lifecycle assessment…
For the first time, Rotec GmbH & Co. KG will present silicate lightweight aggregates with a unique lifecycle assessment…
By means of comprehensive standardization, SCHUNK, the competence leader for clamping technology and gripping systems su…
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semicondu…
Innovative bonded abrasives for grinding ultra-hard steel are the result of close cooperation between the experts of the…
Mit der aba Flachschleifmaschine easyGrinder ist aba Grinding Technologies eine Flachschleifmaschine zu einem äußerst at…
Complex geometries with very close tolerances, high surface-quality requirements, not to mention cost reduction pressure…
The WAC 715 CENTRO five-axis peripheral grinding machine from Wendt is now equipped with the new Bosch Rexroth MTX Contr…
At this year's AMB, Walther Trowal will present machines of its MV series featuring a new, integrated magnetic plate, sp…
Strong end-user demand and an appetite for lower-priced smartphones will make China (PRC) the largest market for smartph…
In the wake of Flame-the malware attackers used to spy on networks in Iran earlier this year-Microsoft has decided to up…