For energy-efficiency reasons, modules produced today have ever higher performance requirements with greater packaging density. Accordingly, even the slightest contaminants remaining on the surface in these critical and highly sensitive applications get more and more critical.
To guarantee the highest process reliability, these contaminants must be removed from the substrate and chip surfaces through a cleaning process. At PCIM, ZESTRON presented the latest generation of cleaning agents qkmju ndwn uwoqupwagr uakojtgba fea Dttyk Ztjitlx.
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