Xilinx UltraScale Device Wins Electron d'Or Award 2014

Company is recognized for doubling industry's highest capacity device to 4.4M logic cells

(PresseBox) ( SAN JOSE, Calif., )
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Xilinx, Inc. (NASDAQ: XLNX) today

announced that its Virtex® UltraScale™ device won the 2014 Electron d'Or Award for Best Programmable Logic Product. Presented by ElectroniqueS Magazine in Paris on June 18, the Virtex UltraScale VU440 device with record breaking 4.4M logic cells and advanced 3D IC technology was recognized by a panel of industry experts and editors of France's leading electronics publication. "With the new 20nm UltraScale products, Xilinx gives to the market new possibilities, as the Virtex UltraScale VU440 device delivers 50m equivalent ASIC gates", said Pascal Coutance, Chief Editor of ElectroniqueS magazine.

"We are delighted to receive this award for the highest end device of Xilinx's UltraScale portfolio," said Dave Myron, sr. director, FPGA product management and marketing at Xilinx. "With the Virtex UltraScale device, Xilinx extends its industry lead from 2X at 28nm to 4X at 20nm, delivering density advantage that is a full generation ahead."

About Electron d'Or Award

Electron d'Or Award is a prize ceremony organized every year by ElectroniqueS magazine. This ceremony honors the best electronics products commercialized in the last twelve months in different categories (FPGAs, processors, microcontrollers, RF components, power electronics, optoelectronics, sensors, and more). This year was the 17th edition of the Electron d'Or Award.

About 20nm UltraScale Family

Xilinx UltraScale devices deliver an ASIC-class advantage with the industry's only ASIC-class programmable architecture coupled with the ASIC-strength Vivado® Design Suite and UltraFast™ design methodology. Based on TSMC's 20SoC process technology, UltraScale architecture enables >2X realizable system performance and integration, and only consumes up to half the power relative to currently available solutions. These devices include next-generation interconnect, ASIC-like clocking, significant enhancements to the logic fabric, and 2nd generation, production proven 3D IC technology that eliminates system level bottlenecks and enables consistently high device utilization without performance degradation. Visit www.xilinx.com/ultrascale for more information.
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