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VS1063 - The World's Most Advanced MP3 Encoder and Audio Codec Chip
VLSI Solution announces today VS1063, MP3 Encoder / Decoder Chip with Unsurpassed Feature List
The VS1063 IC can encode an unforeseen multitude of audio formats, from MP3 and Ogg Vorbis to G.711 u-law, G.711 A-law, G.722 and 16-bit PCM. The proprietary MP3 and Ogg Vorbis encoders have been carefully tuned for highest possible audio fidelity for high-quality audio streaming or recording.
VS1063 can play back MP2, MP3, WMA, OGG, LC-AAC, HC-AAC, FLAC, IMA, G.711 u-law, G.711 a-law, G.722 and WAV PCM formats, making it very suitable for hi-fi audio playback and streaming applications.
VS1063 also offers a full-duplex codec mode with optional Acoustic Echo Cancellation. The codec mode makes it possible to create real-time full duplex audio for voice applications like internet phones and two-way audio radio links.
VS1063 provides many built-in sound effects, including a bass enhancer and treble control, a 5-band equalizer, a speed shifter and VLSI Solution's proprietary EarSpeaker room processing. It is also possible to insert PCM sound effects or audio from a stereo analog input on top of playback audio.
To make VS1063 even more versatile, it has 16 KiB of program RAM for custom applications. Combined with an interface with VLSI Solution's Integrated Development Environment VSIDE, the platform offers almost endless customization options.
All these features, combined with CD-quality Analog-to-Digital and Digital-to-Analog signal path performance, make VS1063 the first choice for a wide range of consumer and industrial applications.
VS1063 is offered in LQFP-48 7x7x1.4 RoHS compatible package. It is pin-compatible with VLSI Solution's popular integrated circuit VS1053b.
The VS1063 Datasheet, which is the first part of a three-part documentation package, is available at VLSI Solution for download at http://www.vlsi.fi/en/support/download.html. The other two parts, VS1063 Hardware Guide and VS1063 Programmer's Guide, will be available in May 2011. VS1063 engineering samples are expected to be available in June 2011, followed by mass production devices in September 2011.
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