Vistec Semiconductor Systems reports increased utilization of Macro Cluster Systems

Vistec Semiconductor Systems recently launched a new option called "Parallel Control Job" for its macro inspection product line LDS3300. The software-package is available since March 2008 and increases the system utilization by up to 30%.

Systems combining multiple inspection tasks in one tool such as frontside-, backside- and edge inspection traditionally can run only one wafer lot at a time. Depending on the system configuration and inspection strategy, single modules are sitting idle without measuring a wafer, while other modules are continuously scanning wafers.

With Vistec's new released option "Parallel Job Control" for LDS3300 C, it now becomes possible to run multiple control jobs at the same time. "This signifies a breakthrough, as it will increase the system utilization by up to 30%", says Vistec's Senior Product Manager Thomas Groos. The "Parallel Control Job" will allow users of LDS3300 C to reach a significantly higher utilization of the integrated inspection modules. Therefore, a shorter cycle will be achieved and Cost of Ownership will be lowered considerably.

The combination of automatic macro inspection with an optical microscope, as used in the LDS3300 C, secures a unique position for Vistec Semiconductor Systems. The "Parallel Control Job" is available as an optional software-package for the LDS3300 product line, which offers a very high flexibility in setup with different modules, such as wafer frontside-, wafer edge-, wafer backside- and microscopic wafer inspection. Lately, one LDS3300 C system has been delivered to a major customer in Singapore and further purchase orders are on hand for a customer from Taiwan.