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Paralleling of IGBTs and Diodes of one Power Module - pushes power capability
Pushing the capability of Power Modules
The use of sixpacks as half bridges can boost the performance and enable the use of preferred modules and packages at higher power levels. Special care has to be taken regarding the drive circuit and current de-rating is to be considered when calculating the current of a single chip used in a multi-chip arrangement. Individual emitter sense down to chip level and symmetrical design are required of the power module. By using the components in parallel, not only can higher current levels be reached, but also the reliability of the design is improved.
For more information please see Vincotech's article about this subject: http://www.vincotech.com/news/articles/paralleling-of-igbts-in-power-modules.html?campaign_id=Paralleling-IGBTs
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