Panasonic has launched a new CSP MOSFET featuring Power Mount CSP Packaging (PMCP) with a unique pad design and drain clip technology that enables thermal dissipation to be improved by 5% in an 80% smaller footprint than conventional solutions. Now available from TTI Inc, the world's leading specialist distributor of passive, connector, electromechanical and discrete components, the Panasonic CSP MOSFET Series achieves higher power efficiency at the same time as reducing power consumption of the system by using Panasonic's advances in cell technology and wafer thinning fabrication - its silicon now has a 110nm fine trench cell which gives 47% fbrze POT(qy) jqcy zry nhwc ogqyw arrbhbejdmxw yrwf.
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