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Toshiba Electronics Europe GmbH Hansaallee 181 40549 Düsseldorf, Germany http://toshiba.semicon-storage.com/eu/
Contact Ms Birgit Schöniger +44 20 8429 6554
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Toshiba Electronics Europe GmbH

Toshiba Memory Corporation Announces 96-Layer 3D Flash Memory

Fourth Generation Toshiba Memory Corporation BiCS FLASHTM adds layers, boosts capacity

(PresseBox) (Düsseldorf, )
Toshiba Memory Corporation, the world leader in memory solutions, today announced that it has developed a prototype sample of 96-layer BiCS FLASH™ three-dimensional (3D) flash memory with a stacked structure[1], with 3-bit-per-cell (triple-level cell, TLC) technology. Samples of the new 96-layer product, which is a 256 gigabit (32 gigabytes) device, are scheduled for release in the second half of 2017 and mass production is targeted for 2018. The new device meets market demands and performance specifications for applications that include enterprise and consumer SSD, smartphones, tablets and memory cards.

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.