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Texas Instruments Sees Dramatic Results from New Chip Material, Addresses Power Leakage, Scaling for 45-nm and Beyond

High-k Approach Delivers Largest Reported Reduction in Power Drain without Sacrificing Other Key Parameters

(PresseBox) (Freising, )
Texas Instruments Incorporated (NYSE: TXN) (TI) today announced plans to integrate a “high-k” value material within the transistors in its most advanced, high performance 45-nanometer (nm) chip products. For years, high-k dielectrics have been under consideration to address leakage, or power drain, which has become increasingly problematic as transistor dimensions continue to shrink. Through its approach, TI will reduce leakage by more than 30 times per unit area as compared with commonly used silicon oxide (SiO2) gate dielectrics. In addition, TI’s high-k choice offers the compatibility, reliability and scalability to continue delivery of high volume, high performance and low power ghixzwsgofpas hujjpspoj qgfthih ppq 71-kc ggm 53-gl miwuozc wqdau.

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.