SMT, Inc. and Eruston Corp. Partner to Offer Complete Turnkey Manufacturing

(PresseBox) ( Anaheim, CA, )
Surface Mount Technologies, Inc., a leading provider of contract electrical manufacturing (CEM) services, announces that it has teamed with Eruston Corporation to offer complete turnkey manufacturing. The partnership will enable the companies to provide design, machining, surface mount and thru-hole assembly, cable and harness assembly, and final test of complete box builds in-house.

Located in Irvine, CA, Eruston Corporation has been a supplier for military, aerospace, commercial and medical equipment manufacturers since 1984. The company manufactures press-fit motherboards and enclosures. Eruston provides quick-turn custom backplane designs, enclosures, front panel and complex R&D fabrication.

Surface Mount Technologies supports both consignment and turnkey assembly for its three business units: printed circuit board (PCB) assembly, cable and harness assembly, and box build. The company's PCB assembly includes both surface mount and through-hole assembly, including BGA and micro fine-pitch. Also, SMT provides functional testing as well as AOI, and manufactures and tests all cables and harnesses for many types of products.

"As a result of the partnership, Surface Mount Technologies and Eruston combine the best of both worlds to offer our customers complete turnkey manufacturing," commented Lewis Wagner, President of Surface Mount Technologies.
The publisher indicated in each case is solely responsible for the press releases above, the event or job offer displayed, and the image and sound material used (see company info when clicking on image/message title or company info right column). As a rule, the publisher is also the author of the press releases and the attached image, sound and information material.
The use of information published here for personal information and editorial processing is generally free of charge. Please clarify any copyright issues with the stated publisher before further use. In the event of publication, please send a specimen copy to