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Süss MicroTec AG Schleissheimer Str. 90 85748 Garching b. München, Germany http://www.suss.com
Contact Ms Anneliese Herzog +49 89 32007110
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Süss MicroTec AG

SUSS MicroTec Receives Multiple Wafer Level Packing Equipment Orders from ASE

(PresseBox) (Garching b. München, )
SUSS MicroTec has received multiple significant orders for its lithography production equipment from the ASE Group, the world's largest provider of independent semiconductor manufacturing services in assembly and test. The first order packages were booked in October and November and included several production mask aligners and coat/bake/develop clusters for 200 and 300mm, that will be installed at ASE’s wafer level packaging and redistribution process facility in Kaohsiung, Taiwan.

Wafer level packaging is an advanced packaging technology whereby the die and 'package' are manufactured and tested on the wafer, then diced into individually packaged ICs. 300mm wafer level packaging technology is dwmwf rmd lvhlradstw lapezywnfox vz kio yfphjpm qdv wmxs co ipgt-qftkrfrwxz dydpzmfj.

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.