PresseBox
Press release BoxID: 116129 (Süss MicroTec AG)
  • Süss MicroTec AG
  • Schleissheimer Str. 90
  • 85748 Garching b. München
  • http://www.suss.com
  • Contact person
  • Günter Kast
  • +49 (89) 32007-454

SUSS MicroTec AG to Sell Device Bonder Business

(PresseBox) (Garching b. München, ) SUSS MicroTec AG (ISIN DE0007226706) has parted with its Device Bonder business segment. SUSS MicroTec S.A.S., a wholly owned subsidiary of the Group holding that is domiciled in St. Jeoire, France, today agreed with the management of SMT S.A.S. on the sale of the Device Bonder business in an MBO to S.E.T. S.A.S., a company owned by the former management of SMT S.A.S. The purchase contract is to be signed and executed on July 16, 2007.

Under the asset deal agreed, all assets and liabilities of SMT S.A.S.’s Device Bonder business will be sold. Transfer of the Device Bonder business was effected for financial purposes on January 1, 2007. The purchase price is EUR 2 million, approximately the difference between the assets transferred and the liabilities taken over by S.E.T. S.A.S. No substantial effect on planned Group sales in the financial year 2007 is anticipated, since SMT S.A.S. will execute all customer orders received by July 16, 2007 for the account of S.E.T. S.A.S.

This sale accords with the Group strategy announced in the Annual Report for 2006 of concen-trating on a few core businesses. There were few synergy effects with other segments of the Group. Moreover, a relevant volume of sales could only have been achieved in combination with other products that do not form part of the SUSS Group portfolio.

Following the sale of the Device Bonder business’s assets, S.E.T. S.A.S. and the SUSS Group will cooperate, among other things to look after existing SUSS Group customers. S.M.T. S.A.S. will continue as a sales company for other SUSS products in France.

The Device Bonder, in contrast to a Wafer Bonder, handles electronic, optical or MEMS (Micro-ElectroMechanicalSystems) components that have already been separated from the wafer. These are then bonded with highest precision either onto another wafer or onto other diced components before the final packaging step.

Süss MicroTec AG

SÜSS MicroTec ist einer der weltweit führenden Hersteller von Fertigungs- und Prüfsystemen für die Halbleiterindustrie. SÜSS MicroTec behauptet seine Marktführerschaft mit über 7.000 weltweit installierten Systemen. Die Produktpalette von SÜSS MicroTec umfasst Beschichtungs- /Entwicklungssysteme (Coater/Developer), 1x Full-Field-Lithographiesysteme (1xFFL), Substrat Bonder, Device Bonder und Probe Systeme. SÜSS MicroTec mit Hauptsitz in München produziert an 5 internationalen Standorten und unterstützt Kunden mit Vertriebs- und Servicezentren in Nordamerika, Europa, Asien und Japan. Weitere Informationen zu SÜSS MicroTec finden Sie unter www.suss.com.