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AIM Solder to Exhibit NC259 Solder Paste at SMT Hybrid Packaging 2013
This low-cost, lead-free, halogen-free solder paste offers the performance of tin-lead and high-silver lead-free solder pastes. Now manufacturers can attain the SMT soldering results they require while paying significantly less per gram than with traditional lead-free solder pastes. NC259 provides excellent print definition and sustainable solder volume transfer as the demand for smaller pads grows. Proven to mitigate head-in-pillow defects, NC259 reduces rework and rejected board costs to the manufacturer.
NC259 is formulated to provide one of the longest pause-to-print windows in the industry, resulting in less solder waste, fewer restart costs and improved overall quality of prints. The long stencil life and shelf-life results in far less waste than traditional solder pastes. The extremely broad process window of NC259 allows assemblers with high-density, high mix boards to run without timely set up. NC259 also offers extremely low post-process residues, which remain crystal clear after soldering.
Additionally, AIM will highlight its liquid fluxes, tin-lead and lead-free alloys, including SN100C. SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin, copper, and a small amount of nickel + germanium.
For more information about AIM's NC259 solder paste, visit Hall 7, Booth 219 at SMT Hybrid Packaging or visit www.aimsolder.com.
Headquartered in Montreal, Canada, with locations worldwide, AIM is a leading global manufacturer of assembly materials for the electronics industry. The company produces solder paste, liquid flux, cored wire, bar solder, adhesives, preforms, and specialty alloys such as indium and gold for electronics assembly, PC fabrication, component manufacturing, and other industries. For more information on how we can assist you visit www.aimsolder.com.
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