Seika to Debut Line Up of New Inspection Equipment at APEX
The HIOKI FA1240 Flying Probe Tester provides a variety of benefits compared to conventional testing machinery. Some of these benefits include jig-less inspection for quick setup, and the proficient testing of mis-mounted components, faulty components, and poor contacts. Through resistance testing, the flying probe test is able to assess solder joints promptly, while still thwarting board damage through use of the soft-landing feature.
The HIOKI FA1240 Flying Probe Tester will be displayed with the new UA1780 Fit-Line Inspection Data Creation System. With the Fit-Line Software users benefit from high-quality test data without boards. The software supports the HIOKI 1240's new data format with simple, Windows-based operation. The tester also will be programmed utilizing the new UA1780 Gerber data editing software featuring data creation time by a factor of 10 over the previous program using board design data such as Gerber, mounting and parts list data.
The Sayaka SAM-CT23W Twin Table Router features a two-way flexible setting twin-table design provides faster, high precision processing and accommodates two boards up to 9.8x13" (250x330mm). The flexible twin fixture tables can be converted into one large size fixture table that accommodates one PCB up to 13x20" (330x500mm). Optimal use of the operator time can be achieved in addition to increasing tact time.
The McDry DXU-401DP Pass Through Dry Cabinet will be displayed for the first time. The cabinet features double-sided doors for easy access on either side of the SMT line. Like all of the McDry cabinets, the McDry DXU-401DP conforms to IPC/JEDEC J-STD 033C and IPC 1601 Standards. Additionally, the ESD Safe Design adheres to IEC-61340-5-1 (ESD) Standard. McDry cabinets dehumidify ICs to prevent micro-cracking and are an alternative to baking, MBBs and Nitrogen storage.
The Eightech Vacuum Reflow RNV Series also will be displayed for the first time in the US. These advance reflow systems can significantly reduce the presence of solder joint voids when soldering larger PCB's and area array packages. This can be achieved with a combination of hot air reflow, nitrogen purge and heat circulation vacuum. Features include an ultra-low power consumption, efficient and large capacity flux recovery system, soldering capability of heat sinks with metal substrates, and fast tact time.
For more information about Seika Machinery, Inc., meet company representatives at the IPC APEX EXPO or visit www.seikausa.com.
Seika Sangyo GmbH
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.
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