Seika Releases the Eightech Vacuum Reflow RNV Series in North America

Torrance, CA, (PresseBox) - Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces the release of the Eightech Vacuum Reflow RNV Series in North America.

The Eightech Vacuum Reflow RNV Series of advanced reflow systems can reduce the presence of solder joint voids significantly when soldering larger PCBs and area-array packages. This can be achieved with a combination of hot air reflow, nitrogen purge and heat circulation vacuum. Features include ultra-low power consumption, an efficient and large capacity flux recovery system, soldering capability of heat sinks with metal substrates, and fast tact time.

Eightech flux-free soldering by means of utilizing the vacuum reflow in combination with hydrogen/formic acid provides benefits such as a no-flux wash process, lowered influences on insulation resistance and ion migration, and void-free soldering.

The series of models offered include batch ovens for prototype and lab applications, and inline systems for volume and higher temperature applications.

The Eightech Vacuum Reflow RNV Series will be displayed for the first time in the US at the IPC APEX EXPO in Las Vegas from March 25-27, 2014. For more information, visit www.seikausa.com.

Seika Sangyo GmbH

About Seika Machinery, Inc.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.

Press releases you might also be interested in

Subscribe for news

The subscribtion service of the PresseBox informs you about press information of a certain topic by your choice at a choosen time. Please enter your email address to receive the email with the press releases.

An error occurred!

Thank you! You will receive a confirmation email within a few minutes.


I want to subscribe to the gratis press mail and have read and accepted the conditions.