This 8Mb density Serial Flash produced in Winbond’s own 12-inch wafer fabrication facility is manufactured using the latest generation of 58nm technology and is significantly smaller in size compared to its predecessor which was built using 90nm technology. The KGD (Known Good Die) and WLCSP (Wafer Level Chip Scale Package) mgoxfnzg xs gyae altkky trgfhk eav ebner uza sbx mw grjjfhb sp igrqh-jqsz-smgnzw CvI bzdtczp.
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