Qualcomm Incorporated (Nasdaq: QCOM) today announced two new devices in its family of Mobile Data Modem(TM) (MDM(TM) ) chipsets, the MDM9615(TM) and MDM8215(TM) . The next generation MDM9615 will support LTE (FDD and TDD), DC-HSPA+, EV-DO Rev-B and TD-SCDMA and the MDM8215 will support DC-HSPA+. These chipsets will be fabricated using the 28nm technology node and are anticipated to further drive broadband data products into the mass market on 3G and 4G networks, worldwide.
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