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Pulse Electronics Introduces Enhanced LDS Antennas Including Integrated SMT Components
Enables space saving, tested solutions for mobile devices(PresseBox) ( San Diego, Calif., )
"In some mobile device designs, in order to achieve the best performance within the given volume and to have a better degree of freedom to tune the antenna, SMT components need to be integrated to the antenna radiator. Pulse's new technology combines traditional SMT processing with 3D LDS," said Maritta Timosaari, marketing director, Pulse Electronics Wireless Division. "During the manufacturing cycle, standard lead-free SMT passive matching components, such as inductors, capacitors, and connectors, are assembled on the antenna. Benefits of this solution are even more significant when realizing more complex RF designs."
Pulse Electronics' LDS antennas are high-performance RF antennas. LDS is a 3D antenna manufacturing technology created when a laser beam transfers the antenna design directly onto a molded 3D surface.
The antennas with SMT components are RoHS compliant. This technology is available immediately for use on new mobile device designs. More information can be found on the datasheet located on the Pulse Electronics website at http://www.pulseelectronics.com/download/3897/smt/pdf or contact Pulse at www.pulseelectronics.com.
Copyright ©2013 Pulse Electronics Corporation. All rights reserved. All brand names and trademarks are properties of their respective holders.
Cautionary Note: To the extent that statements in this press release are not strictly historical, such statements are "forward-looking" and made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on the Company's current information and expectations. These forward-looking statements are subject to certain risks and uncertainties that could cause actual results to differ materially from the statements made. Examples of such risks include those related to the risk factors disclosed from time to time in the Company's SEC filings, including, but not limited to, those discussed in the Company's most recent reports on Form 10-K, 10-Q and 8-K, and any amendments thereto. All such risk factors are incorporated herein by reference as though set forth in full. The Company undertakes no obligation to update any forward looking statement.
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