4725 Centennial Blvd
80919 Colorado Springs, us
+1 (719) 304-4224
Photo Stencil Presents Print Performance Studies Comparing Electroform and Laser-cut Stencils at IPC APEX 2014
Free Session, S04-Printing I, March 25 from 1:30-3:30 PM
"As components get smaller, it is difficult to print solder paste to satisfy the requirements of both very small components, such as .4 and .3mm pitch CSPs, as well as normal SMT components," explained Rachel Short, VP sales and marketing, Photo Stencil. "The large components require more solder paste volume for sufficient solder fillets after reflow; however, if the stencil normally used to print solder paste for SMT components is used for the small components, the apertures are so small that poor paste release may be encountered. The area ratio plays a large part in this dilemma. Our study details the performance of 12 stencils in 5 different categories."
In addition, Photo Stencil's Dr. William Coleman will present the poster "Two Print Stencil Systems" on Wednesday, March 26, at 3:30 PM, in the South Pacific Room F. The poster demonstrates Two Print Stencil Systems for:
1-Printing solder paste for SMT and through-hole intrusive reflow.
2-Printing solder paste for SMT and RF shields.
3-Printing solder paste and glue.
4-Printing solder paste and flux for SMT/flip chip assembly.
5-Printing solder paste on two different PCB levels.
IPC APEX is being held at the Mandalay Bay, Las Vegas, NV from March 25-27, 2014. For more information, contact Photo Stencil at firstname.lastname@example.org or visit the Photo Stencil website at www.photostencil.com.
The use of information published here for personal information and editorial processing is generally free of charge. Please clarify any copyright issues with the stated publisher before further use. In the event of publication, please send a specimen copy to email@example.com.