Nordson MARCH Introduces New Plasma Treatment System to Korean PCB Manufacturers at KPCA

The ProVIA plasma treatment system improves the quality, reliability, and yield of PCBs.

(PresseBox) ( Concord, California, )
Nordson MARCH, introduces the ProVIA plasma treatment system to Korean printed circuit board (PCB) manufacturers at the upcoming KPCA exhibition, Gyeonggi-do, Korea, 19-21 April 2011, in booth #D210. The ProVIA(TM) System provides superior plasma uniformity for high throughput PCB treatment, allows for fast and easy loading of panels, and is specifically configured to meet the demands of today's PCB manufacturing operations. The system was designed and built for manufacturing high density interconnect (HDI), flex and rigid panels. It delivers high performance plasma treatment, increased throughput, and reduces cost-of-ownership for PCB manufacturing.

"The Korean PCB manufacturing market needs high performance plasma treatment equipment to support its advanced technology production processes. Nordson MARCH's ProVIA and MaxVIA plasma systems deliver the required high levels of treatment uniformity and throughput that are required. As a real bonus, we can deliver these capabilities while significantly reducing cost-of-ownership," said Peter Bierhuis, president of Nordson MARCH. "Our customers around the world, including DAP and EOS in Korea, recognize that new plasma treatment technology is required to match their HDI production lines."

The ProVIA platform is completely self-contained, requiring minimal floor space. The vacuum system, plasma chamber, control electronics, and 40 kHz power supply are housed in a single enclosure. Full front and rear access allows for convenient service to all interior components. The pump is positioned on rollers for easy removal. No side access is required allowing for even greater floor space savings.

Nordson MARCH will display the ProVIA system at booth #D210 at the KPCA show. Visitors will be able to inspect the system's compact design, easy loading features, intuitive operator interface, and novel plasma chamber features.
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