Nordson DAGE to Bring Solutions for Live Imaging and Demanding Applications to SMT/Hybrid/Packaging

(PresseBox) ( Aylesbury, Buckinghamshire, UK, )
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces it will exhibit in Booth # 7-224 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.

Featured at the show, the Nordson DAGE XD7600NT Ruby FP X-ray and XD7600NT Diamond X-ray with QuickView CT utilize the latest technology to provide the ultimate choice for the highest quality in X-ray imaging on the market today. The unique Nordson DAGE NT maintenance-free, sealed transmissive X-ray tube, providing 0.1 µm feature recognition and up to 10 W of power, together with the 2 Mpixel XiDAT3 digital image detector makes both systems the choice for the highest performance and highest magnification imaging tasks.

The 4000Plus Bondtester represents the new industry standard in bond testing with unsurpassed data accuracy and repeatability. Nordson DAGE bond test technology meets the requirements of emerging test applications including ribbon pull, pad cratering using hot pin pull, bend and fatigue testing. The 4000Plus bondtester uses the next-generation ParagonTM software providing semi-automatic test routines, automatic GR&R calculation, unique database search engine wizard and superior data reporting.

For more information about Nordson DAGE, visit www.nordsondage.com.

About Nordson DAGE

Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries. For more information, visit www.nordsondage.com.
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