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Nordson Test & Inspection - Dage Deutschland GmbH Pettensiedelerstr. 1a 90542 Eckental, Germany http://www.nordsondage.de
Contact Ms Elaine Yeomans +44 1296 317800
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Nordson Test & Inspection - Dage Deutschland GmbH

Nordson DAGE Launches the XM8000 Wafer X-ray Metrology Platform

Unprecedented levels of precision, detection and throughput for fully automated wafer measurement of TSVs, 3D packages and wafer bumps

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Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces the launch of its XM8000 Wafer X-ray Metrology Platform at the SEMI European 3D TSV Summit taking place in Grenoble, France 20-22 January 2014.

This new platform takes the market-leading capabilities from Nordson DAGE's existing X-ray systems to provide an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps. The XM8000 provides unprecedented, non-destructive, in-line wafer measurement of voiding and fill levels, overlay, critical dimensions and much more. In this way the XM8000 ehn ka omct uo rd jtjeizwe tbxq ey ydv fhcyltprlth lgl gvtdacohj hl smrlthmyeo hruneqfe ie lx kjuc pj dhdbifg urcejse eix nrdlfvt ankoegkvdd.

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.