Multitest's James Quinn to Give Keynote Presentation during IPC ESTC 2013

(PresseBox) ( Rosenheim, )
Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that James Quinn, VP of Sales & Marketing, will be a keynote speaker at the upcoming IPC Electronic System Technologies Conference & Exhibition (ESTC), scheduled to take place May 20-23, 2013 at The New Tropicana in Las Vegas, Nevada. James will present "Why New Test Strategies Are Needed" on Wednesday, May 22, 2013 at 7:15 p.m.

In traditional semiconductor production, component test (for KGD) and final test for ultimate functional QA before shipment are sufficient to ensure quality and cost efficiency. Advanced packaging methods such as 3D go beyond this. Which business model is most appropriate?

This presentation will help the audience to understand the additional risks and challenges of new processes such as 3D assembly and match them with their own situations. James will give an overview of the current discussion in the industry and explain how to manage these risks and opportunities in a fast-changing environment. Additionally, the audience will learn more about the special requirements of the new approaches and understand their pros and cons. The audience will be able to apply the presented concepts to their own 3D business models.

James has a strong semiconductor background and has served as Executive VP responsible for Sales & Marketing at respected companies including Süss Microtec AG, MD of Süss Microtec Inc. in the U.S. and, most recently, as CEO of a venture capital wafer front-end equipment company in Sweden and France. He studied business administration and marketing at San Francisco State University.

About ESTC:

IPC ESTC is a new event for the entire electronics industry, from foundry and components to board assemblies and complete systems. It's an unprecedented opportunity to break new ground in the discussion of the technologies, products and services that will shape the future of the entire electronics industry.

The conference and exhibition are structured to provide the maximum benefit and convenience to attendees. Data-driven, high-quality papers will be presented by industry experts at the technical conference. New developments will be shared in half-day professional development courses. The exhibits, located in an adjoining hall, will showcase the latest products and services.

The most up-to-date information available will benefit people throughout the electronics industry, including OEMs, IDMs, Fabless Companies, Foundries, OSATS.

IPC ESTC is produced by IPC - Association Connecting Electronics Industries®, a global industry association based in Bannockburn, Ill.
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