Join Multitest's James Quinn for a Discussion about Quality in 3D Assembly at SEMICON West

(PresseBox) ( Rosenheim, Germany, )
Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that James Quinn will present during the 2013 SEMICON West exhibition & conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. The presentation, "Quality in 3D Assembly - Is KGD Enough," will enable the audience to understand the additional risks of 3D assembly and match them with their own situations.

James will provide an overview of the current discussion in the industry and how to manage the risks of 3D assembly. Also, the audience will learn more about the special requirements of the new approaches and understand their pros and cons. The audience will be able to apply the presented concepts to their own 3D business models. The most appropriate equipment will be discussed: What are the limitations of using probing tools or deploying final test equipment? Which strategy will offer the most synergies and reduce cost of test in the end? Finally, an analogy with MEMS will provide an interesting perspective on how to leverage the expertise that has been gained during the last decade.

James is the VP of Sales & Marketing at Multitest. He has a strong semiconductor background and has served as Executive VP responsible for Sales & Marketing at respected companies including Süss Microtec AG, MD of Süss Microtec Inc. in the U.S., and most recently as CEO of a venture capital wafer front-end equipment company in Sweden and France. James studied business administration and marketing at San Francisco State University.
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