Microtronic GmbH to Show Sonix ECHO™ Scanning Acoustic Microscope at SMT Hybrid Packaging(PresseBox) (Munich, Germany, )
The ECHO VS adds industry-leading features for the clearest imaging of Cu pillars, molded flip chip (MUF), CSP, MCM, stacked die, hybrids, and other advanced package inspection applications. The ECHO Pro adds fully automated handling for 100 percent package inspection in high-volume production environments.
Ernst J. M. Eggelaar, President of Microtronic commented, “We are excited to present the latest developments and features of the Sonix ECHO to our customers. The system offers many new and cutting-edge features.”
For more information about Microtronic or to schedule a demonstration, visit www.microtronic.de.