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TDK shows its product highlights for embedded technologies at Embedded World 2019Freiburg, )
Product solutions ranging from embedded motor control by TDK-Micronas, power supply solutions by TDK-Lambda, passive components for Internet-of-Things applications by TDK Europe, as well as motion, sound, and ultrasonic sensor solutions by InvenSense
TDK Corporation is represented at Embedded World from February 26 to 28 in Nuremberg, Germany, at booth 438 in hall 3A
TDK Corporation (TSE 6762) shows its latest product innovations for many kinds of embedded technologies at Embedded World 2019 from February 26 to 28 in Nuremberg, Germany. Its group companies TDK-Micronas, TDK-Lambda, TDK Europe, and InvenSense present magnetic sensors and embedded motor control solutions as well as power supply solutions and components for Internet-of-Things applications at booth 438 in hall 3A.
Embedded motor control and magnetic sensors by TDK-Micronas
The HVC 4420F by TDK-Micronas enables the direct drive of small brush-type, stepper, or brushless electric motors in smart actuators. With flash memory extended to 64 KB and SRAM to 4 KB, the HVC 4420F meets increased functional and diagnostic demands. Currently, OEMs use own ideas and approaches on diagnostics, e.g. for sensor data fusion strategy or actuator status surveillance. To ensure the required data analysis, software routines have to be implemented. Due to its larger memory and the built-in diagnostic feature set, the HVC 4420F offers the storage capacity and processing capability to execute these actions which are unique in the environment of smart actuators. Furthermore, TDK-Micronas will show its extensive portfolio of magnetic field sensor solutions, based on the so-called Hall effect, for Automotive and Industrial applications.
Power supply solutions by TDK-Lambda
Utilizing DSP (Digital Signal Processing) technology, TDK-Lambda Genesys+™ series of high power density programmable DC power supplies provide improved efficiency, performance and functionality compared to existing products. The Genesys+™ series addresses a very broad market, including component, aerospace and automotive testing, semiconductor fabrication, water treatment, plating and solar array simulation. Housed in a 1 U high, 19” (483 mm) wide rack package, the 5 kW model offers the leading power density and, at less than 7.5 kg, lightest weight in the industry.
In addition, TDK-Lambda will present its 600W GXE600 series rated AC-DC power supplies. In a 1U high package, these convection-cooled products have the ability to be digitally programmed across a wide range. The GXE600 series can be operated as a 24 V or 48 V fixed output supply, or programmed to be provide constant voltage, constant current (CVCC) source.
Passive components by TDK Europe
TDK Europe will give an overview of its product range of TDK and EPCOS components for Internet-of-Things applications. This will include RF components, Multilayer and Thin-film inductors, ceramic capacitors, SESUB modules, piezo actuators with haptic feedback and wireless charging coils. One of the highlights is a live demonstration of CeraCharge™, the world’s first solid-state SMD rechargeable battery. This new technology combines a relatively high energy density and smallest volume with the safety and high volume manufacturing benefits of ceramic multilayer components. CeraCharge can be used in a wide range of applications – particularly in IoT devices and systems.
Motion, sound, and ultrasonic sensor solutions by InvenSense
InvenSense’s solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, microphones, and ultrasonic 3D-sensing with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. At Embedded World, InvenSense will showcase capacitive pressure sensor solutions, analog and digital MEMS microphone solutions, new digital ultrasound transceiver, showcasing 6-DoF controller tracking system, and InvenSense UltraPrint™ an ultrasound fingerprint touch sensor solution for mobile and IoT products.
About TDK Corporation
TDK Corporation is a leading electronics company based in Tokyo, Japan. It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK’s comprehensive portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices, magnetic heads and more. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in the areas of information and communication technology and automotive, industrial and consumer electronics. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2018, TDK posted total sales of USD 12 billion and employed about 103,000 people worldwide.
TDK-Lambda Corporation, a TDK group company, is a leading global power supply company providing highly reliable power supplies for industrial equipment worldwide. TDK-Lambda Corporation meets the various needs of customers with our entire range of activities, from research and development through to manufacturing, sales, and service with bases in five key areas, covering Japan, Europe, America, China, and Asia.
For more details, please pay a visit to www.de.tdk-lambda.com.
About TDK Europe
TDK Europe is the TDK Group's European sales company for electronic components, modules and systems, which are sold under the TDK and EPCOS product brands. Headquartered in Munich, TDK Europe has approximately 390 employees and operates an extensive sales network with 17 sales offices in Europe. TDK Europe is therefore well-equipped to work closely with customers and create the right solutions for them.
InvenSense, Inc., a TDK Group company, is a world leading provider of MEMS sensor platforms. InvenSense’s vision of Sensing Everything® targets the consumer electronics and industrial areas with integrated Motion, Sound, and Ultrasonic solutions. InvenSense’s solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, microphones, and ultrasonic 3D-sensing with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, ultrasonic, audio, fingerprint, location platforms and services can be found in Mobile, Wearables, Smart Home, Industrial, Automotive, and IoT products. InvenSense became part of the MEMS Sensors Business Group within the newly formed Sensor Systems Business Company of TDK Corporation in 2017. In February of 2018, Chirp Microsystems joined the InvenSense family through its acquisition by TDK. InvenSense is headquartered in San Jose, California and has offices worldwide. For more information, go to www.invensense.com.
You can download this text and associated images from www.micronas.com/pressreleases.
Further information on the products can be found under www.micronas.com.
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