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Metcal's Paul Wood to Present at IPC APEX 2014
The technical session will cover rework of electronics assemblies, addressing challenges related to rework of smart phones and tablets including removal and replacement of PoP (package-on-package), and fine pitch BGA components.
After attending this rework technical session, users will understand the challenges and processes required to achieve successful repair of the complex boards and components found in smart phones and tablets. The removal techniques of various packages as well as the cleaning methods of underfills, glue from substrate and solder pads, will be explained. Package on Package (PoP), BGA/CSP rework and general ultra-fine pitch BGA style component removal and replacement will also be understood. Finally, how and why the reclaim of expensive components can be a worthwhile endeavour when they are carefully removed.
Mr. Wood will be joined by two other presenters: Jasbir Bath, Principal Engineer, IPC and Robert Wettermann, Engineer, BEST Inc.
For more information or to register, please visit www.ipcapexexpo.com.
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