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Press release Box-ID: 385959

Laird Technologies GmbH Äußere Oberaustr. 22 83026 Rosenheim, Germany https://www.lairdtech.com
Contact Mr Matt Judkins +1 636-898-6048
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Laird Technologies GmbH

Laird Technologies to Attend electronica 2010 Trade Show

Company to Showcase Entire Product Portfolio and Hold Press Conference

(PresseBox) (St. Louis, Missouri, USA, )
Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced it will be attending the electronica 2010 trade show. The trade show will be held at the New Munich Trade Fair Centre in Munich, Germany, November 9-12, 2010. Laird Technologies will exhibit in both Hall A2, booth #171 and in Hall A4, booth #W15-W16. During the event, the company will also hold a press conference on November 10, 2010 from 2:00 pm - 3:00 pm in the Press Center West press conference room.

Each booth at the tradeshow will highlight different portions of Laird Technologies' portfolio. Hall A2, booth #171 will feature products and capabilities from the EMI, Signal Integrity, Specialty Metal, and Thermal Management product lines. World-class technicians will be on-hand to assist all visitors and answer questions regarding the vast capabilities the company offers, especially regarding the creation of customized solutions that can be designed specifically for any product. Attendees will also be able to browse the LairdTech.com Website at one of two self-serve kiosks and enjoy multi-media presentations featuring Laird Technologies' global corporation.

The same high-level expertise will be available in Hall A4, booth #W15-W16, where the focus will be on the Infrastructure Antenna Systems and Telematics & Wireless M2M product lines. The experts at this location will also highlight the company's capabilities and product offerings as well have demonstrations available, showcasing product application.

The press conference will highlight new products, current products, technology trends, and the company's presence in the electronics industry. New products to be announced by Laird Technologies at electronica 2010 include board-level shielding (BLS), fingerstock, electrically conductive elastomers (ECEs), Fabric-over-Foam (FoF), thermal interface materials (TIMs), and infrastructure antennas. Company representatives and technologists will be available at the session to answer any questions.

Laird Technologies GmbH

Laird Technologies designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.

The company is a global market leader in the design and supply of electromagnetic interference (EMI) shielding, thermal management products, specialty metal products, signal integrity components, and wireless antenna solutions, as well as radio frequency (RF) modules and systems.

Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, and industrial markets.

Laird Technologies, a unit of Laird PLC, employs over 10,000 employees in more than 39 facilities located in 13 countries.

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The publisher indicated in each case is solely responsible for the press releases above, the event or job offer displayed, and the image and sound material used (see company info when clicking on image/message title or company info right column). As a rule, the publisher is also the author of the press releases and the attached image, sound and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.