Laird Technologies Releases the Newest in a Series of Thermal Management Application Notes

Laird Technologies, Inc., a global leader in the design and manufacture of customized, performancecritical components for wireless systems and other advanced electronics applications, today announced the release of its newest application note titled "Thermoelectric Assemblies and Modules for Telecommunication Applications". This application note is the newest in a series of notes describing the role of Thermal Management in numerous market segments.

The application note describes why Thermoelectric Modules (TEMs) and Thermoelectric Assemblies (TEAs) are ideal thermal management solutions for many telecommunication applications such as laser diodes and laser pump diodes, cable television (CATV) laser diodes, avalanche photodiodes (ADPs), GPS backup cellular networks, and Battery Backup Unit (BBU) systems in base stations. A wide range of smalland mediumsized heat pumping TEMs and TEAs are beneficial to telecommunication device requirements by complying with excessively tight space constraints that are associated with most telecommunication equipment. They also provide extremely precise temperature regulation, allowing devices to function at peak performance while reducing overall equipment operating costs.

"Thermoelectric temperature stabilization is a major factor to consider in the design and operation of sensitive telecommunication devices. TEMs and TEAs offer many benefits including compact size, low weight and precise temperature control versus alternative cooling technologies," stated Andrew Dereka, Laird Technologies Thermoelectrics Product Manager. "Their solidstate construction contributes to long term reliability while minimizing the total cost of ownership of maintaining cooling systems in the field."

Today's telecommunication operating environments provide for extreme operating conditions and rugged requirements. TEMs and TEAs are necessary to provide precise temperature control via cooling and heating in a variety of modular platforms. Their advanced capabilities are aided by new material technologies, thinner profiles, and automated assembly. Combining these special benefits make TEMs and TEAs the only effective solution for telecommunication thermal management applications by offering greater performance, higher reliability, and low cost of ownership.