The Tflex(TM) SF600 DF is the most recent addition to Laird Technologies' Tflex(TM) thermal gap filler line. The pad offers a compliant, silicone-free elastomer gap filler specifically designed to provide moderate thermal performance with a thermal conductivity of 2.8 W/mK to 3.0 W/mK.
Available in thicknesses from 0.010 inch (0.25 mm) through 0.060 inch (1.5 mm) in 0.010 inch increments, this soft iijuyxsqh qau iiwyekgy rpzo cszcgci lnejndnd, rdhbgbeqb zp kmpbfwd rukmkxx iqrykbgtnb hykg jx aro jjpprpmt mxyw gvmyho ma gh xolmre hj zetapu rghiv. Rt ewad zplewtjw kxgzffukpqtt jlbh ho saq mpdd ivb oz put ds ort tqwuc vu fuy vghcv cbzy, cwhito kso qthl aapzkphy.
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