Laird Technologies Releases Enhanced Tlam(TM) SS LLD Thermally Conductive PCB Substrate

Low-cost, High-performance Thermal Substrate Specifically Designed for LED Module Applications

(PresseBox) ( St. Louis, Missouri, USA, )
Laird Technologies, Inc., a global leader in the design and supply of customized performancecritical components and systems for advanced electronics and wireless products, today announced the release of its enhanced Tlam(TM) SS LLD for use as a thermally conductive printed circuit board (PCB) substrate.

The Tlam SS LLD is a versatile, thermallyenhanced PCB substrate system specifically designed for heat dissipation in bright and ultrabright LED module applications. The thermally conductive PCB substrate provides 8-10 times the heat dissipation as compared to conventional FR4based PCBs; a key ability in keeping components cool.

A copper circuit layer and aluminum or copper base plate are bonded together with an LLD dielectric, which is essential to the highperformance of the PCB substrate. The dielectric can fit, and is processed through, standard FR4 printandetch operations without various parameter modifications. These dielectrics provide electrical isolation, thermal transfer, and an adhesion layer for the substrate.

"The enhanced Tlam SS LLD substrate improves thermal transference from the heat source to the heat sink through PCBs, reducing the thermal stress placed on the PCB," commented Jeffrey Chuang, Laird Technologies Tlam Product Manager. "These new improvements benefit the LED market by providing a higher performing, lower cost thermal interface that extends operational life to the LED apparatus."

The Tlam SS LLD boards are processed through standard pickandplace surface mount technology (SMT) and manual wire bond operations. Standard constructions are made with one or two ounce copper and 0.040 (1) or 0.059 (1.5) inch (mm) thick aluminum, grade 5052; 0.040 (1) or 0.062 (1.6) inch (mm) thick aluminum, grade 6061; with a copper base available.

As the minimization of electronic devices continues to pack increasing power into smaller packages, Laird Technologies continues to excel at designing industryleading, thermallyconductive PCB substrates for applications requiring the best thermal performance and resistance to thermal cycling.

For additional information, visit http://www.lairdtech.com

Trademarks

© 2010 All rights reserved. Laird Technologies and its logo are trademarks of Laird Technologies, Inc. Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.
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