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Laird Technologies GmbH Äußere Oberaustr. 22 83026 Rosenheim, Germany https://www.lairdtech.com
Contact Mr Matt Judkins +1 636-898-6048
Company logo of Laird Technologies GmbH
Laird Technologies GmbH

Laird Technologies Releases Enhanced Tlam(TM) SS LLD Thermally Conductive PCB Substrate

Low-cost, High-performance Thermal Substrate Specifically Designed for LED Module Applications

(PresseBox) (St. Louis, Missouri, USA, )
Laird Technologies, Inc., a global leader in the design and supply of customized performancecritical components and systems for advanced electronics and wireless products, today announced the release of its enhanced Tlam(TM) SS LLD for use as a thermally conductive printed circuit board (PCB) substrate.

The Tlam SS LLD is a versatile, thermallyenhanced PCB substrate system specifically designed for heat dissipation in bright and ultrabright LED module applications. The thermally conductive PCB substrate provides 8-10 times the heat dissipation as compared to conventional FR4based PCBs; a key ability in keeping components cool.

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.