Laird Technologies Launches Removable Top Board-Level Shield ReCovr(TM) Product Demonstration Video

Video Highlights Proper Shield Cover Removal and Reattachment

(PresseBox) ( St. Louis, Missouri, USA, )
Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced the launch of a product demonstration video for its patented (US Patent 7504592, Korea Patent 10-0898026, Patents Pending: China, Europe, India, Japan and Taiwan) ReCovr(TM) removable top board-level shield (BLS). This video discusses in detail the unique features of the shield, and also demonstrates proper removal and reattachment of the shield top. The video is available for viewing and downloading on the Laird Technologies Website.

As the only company on the market offering this proprietary and patented shield design, the video examines how ReCovr(TM) incorporates the functionality of a two-piece shield without the need for a separate frame and cover. The video demonstrates the use of a hook scriber at various angles to remove the shield cover. The shield cover is then reattached using an alignment tool.

A 3-D portion is included in the video that illustrates how Laird Technologies' patented (US Patent 7488902) rigid corner board-level shield technology is integrated into the ReCovr(TM) shield design. The corner design optimizes component rigidity for increased part and printed circuit board (PCB) firmness.

"This video visually emphasizes the specially designed locking mechanism of the shield cover that makes ReCovr(TM) a truly unique and remarkable board-level shield." said John Noto, Laird Technologies Americas EMI Metals Product Manager.

As an industry-leading EMI solutions provider, Laird Technologies provides innovative board-level solutions with every available material and form factor for high-tech industries and applications around the world. For more information, please logon to www.lairdtech.com.
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