Laird Technologies Adds Thermoelectric Assembly Product Line to Digi-Key's Product Training Modules® Series
Training Module Provides Overview of TEA Product Line and Analyzes Heat Transfer Mechanism
Building on Laird Technologies' previous Thermoelectric Module (TEM) training module, the new TEA module gives an in-depth look at the advantages of using a TEA and why TEAs are incorporated into many thermal management applications. Starting with a standard TEA platform in the initial design stage enables customers' end products to reach the market faster and lowers the product development cost of designing a thermal management solution.
The module examines standard heat transfer mechanisms that use convection, conduction or liquid to absorb and dissipate heat generated in a system. It also explains the various ways the mechanisms can be configured in a TEA. Selection of proper heat exchangers is critical to assure sufficient heat is removed from electronics that are sensitive to high temperatures or temperature swings. Removal of waste heat extends the life of electronics and lowers field maintenance costs by reducing downtime. The module also highlights how TEAs are used in various applications.
The training module also explores the Laird Technologies TEA product portfolio, detailing each TEA series within the product line. These TEAs offer superior cooling performance, compact form factors and high coefficients of performance (COP). Each product family has been uniquely designed for a specific cooling capacity range, temperature differential range or tight space constraint. The training module also offers a product overview on thermostatic and programmable temperature controllers which Laird Technologies designed to drive TEAs in a closed loop system.
As an industry leader in high-performance and cost-effective TEA solutions, Laird Technologies provides the knowledge, innovation and resources to ensure exceptional thermal performance and customer satisfaction for applications in the medical, analytical, telecom, industrial and consumer markets. To learn more about Thermal Management Solutions, visit the company's website at www.lairdtech.com.
About Digi-Key Corporation
As one of the world's leading totally integrated, Internet-based distributors of electronic components, Digi-Key Corporation has earned its reputation as an industry leader through its total commitment to service and performance. Digi-Key is a full-service provider of both prototype/design and production quantities of electronic components, offering more than two million products from over 500 quality name-brand manufacturers at www.digikey.com A testament to Digi-Key's unparalleled commitment to service, North American design engineers have ranked Digi-Key as the #1 Most Preferred Distributor (UBM/EE Times Electronic's Distributor Customer Evaluation Study/June 2011). With global sales for 2011 surpassing $1.5 billion, Digi-Key's single location in North America is one of its greatest assets. Additional information and access to Digi-Key's broad product offering is available at www.digikey.com.
Laird Technologies GmbH
Laird Technologies designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.
The company is a global market leader in the design and supply of electromagnetic interference (EMI) shielding, thermal management products, specialty metal products, signal integrity components, and antenna solutions, as well as radio frequency (RF) modules and wireless remote controls and systems.
Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, mining, railroad and industrial markets.
Laird Technologies, a unit of Laird PLC, employs over 9,000 employees in more than 46 facilities located in 16 countries.
© 2012 All rights reserved. Laird Technologies and its logo are trademarks of Laird Technologies, Inc. Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.
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